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(Chapter / Bokkapittel / PublishedVersion; Peer reviewed, 2017)
Plasma accelerators support accelerating fields of 10-100’s of GV/m over meter-scale distances and routinely produce femtosecond-scale, multi-kA electron bunches. The so called Trojan Horse underdense photocathode plasma ...
(Chapter / Bokkapittel / AcceptedVersion; Peer reviewed, 2017)
Wafer-level thermocompression bonding (TCB) using aluminum (Al) is presented as a hermetic sealing method for MEMS. The process is a CMOS compatible alternative to TCB using metals like gold (Au) and copper (Cu), which are ...